Epoxy circuit board industry will peak in the shuffle(A)

Epoxy printed circuit board (PCB) welcomed the development of a new peak, the industry reshuffle is inevitable – China Epoxy Resin Industry Association experts have made such a gesture. The expert said that the world of electronic circuit industry, whether PCB Sony VGP-BPS8 Battery , CCL, or other related industries, from the second half of 2003 are beginning to have a complete recovery. The development of the entire electronic circuit industry, especially in China’s development, ushered in a new heights. China’s domestic demand and foreign industries, driven by the ongoing shift has been gradually formed PCB, CCL production value of the largest and most active center of technological development area. China PCB ushered in a new development opportunity, but the new level of competition will optimize the industry structure adjustment, to achieve industrial upgrading.

According to the World Sony VGP-BPS9 Battery Electronic Circuits Council WECC statistics. In epoxy resin printed circuit board (PCB) industry, in 2006, Japan accounted for approximately 11.7 billion U.S. dollars, an increase of 4%; South Korea’s output of 5.7 billion U.S. dollars, an increase of 5.7%; China’s output of 12.8 billion U.S. dollars (based on calculation of 1:7.80), Global output is expected to about 450 billion to 46 billion U.S. dollars, such a good momentum of growth will continue into 2007. PCB product structure from the world’s point of view, the next generation of electronic systems to the PCB requirements of outstanding performance in a more high-density technology. As electronic products, multi-functional machine, small, lightweight development, multilayer, flexible printed circuit board FPC, Rigid-flex board, HDI / BUM substrates, IC package substrates, etc. has become a demand for varieties Great product. In recent years, the technological development of the world’s PCB concentration reflected in the passive (ie, submerged or embedded) components PCB, optical technology, PCB and other new PCB product vgp bps2c, PCB ink-jet technology, and nano-materials in the application of pcb board and so on.

The world’s PCB industry characterized as follows: First, as the components of an integrated chip and IC BGA (ball grid array), CSP (Chip Scale Package) and MCM (multi-chip module) package of the increasing popularity of PCB terminals showing a package miniaturization, packaging development trend of high integration to meet the high-density assembly requirements; Second, with the optical interface technology, will appear in the PCB to achieve optical wiring, optical PCB technology, optical surface mount technology, and optical in-one modular technology (optical components and electrical parts in the same module combination of design techniques, installation techniques); 3, with the high-speed systems, PCB impedance matching has VGP-BPS2A become an important issue, according to Signal speed and routing of different length to require distortion to 10% or 5% or even below 3%; Fourth, to meet the CSP and Flip Chip Package (FC) development, need to use the lead with a hole inside (IVH) structure of the high – density PCB VGP-BPS10, but its high price limits its use, therefore need to continuously optimize the existing Build-up process, so that IVH structure for low-cost mass production PCB.